System on Module Development Board FET-MX9596-C

$399.00

OK-MX9596-C Development Board

To minimize your development workload, we can provide starter kits that serve as complete development platforms for evaluation and application development. The OK-MX9596-C Single Board Computer from Forlinx is powered by the NXP i.MX9596 processor, which features 6 ARM Cortex-A55 cores alongside Cortex-M7 and Cortex-M33 cores. With a SoM + Carrier Board split design and 320 pins, it offers seamless functionality and easy customization, and supports the Linux system. With an open system architecture design, it can provide technical information for your secondary development.

Specifications:

  • CPU: NXP i.MX9596
  • Architecture: 6x Cortex-A55@1.8GHz + 1x Cortex-M7@800MHz + 1xCortex-M33@333MHz
  • Frequency: 333MHz ,800MHz,1.8GHz
  • RAM: 8GB LPDDR4x
  • ROM: 64GB eMMC
  • System: Linux 6.6.3

HTS Classification: 8543709860
Export Classification: 8543709990

Ships From: China

Brand: Forlinx Embedded Technology SKU: MX9596-C Categories: , , , Tags: , , ,

System on Module Development Board FET-MX9596-C based on NXP i.MX95 Series Processor

FET-MX9596-C System on Module / Computer on module is built on the NXP i.MX95xx high-performance processor, featuring six ARM Cortex-A55 cores, one Cortex-M7 real-time core, and one Cortex-M33 security core. Integrates a 2 TOPS NPU for AI acceleration, an ARM Mali-G310 GPU for 3D/2D graphics, and a built-in ISP supporting 4K@30fps video and dual MIPI-CSI cameras.

The FET-MX95xx-C SoM is developed and designed based on the NXP i.MX95 series processors are suitable for various edge applications, including automotive wireless connectivity, eCockpit systems, Industrial 4.0, and IoT platforms. This series supports NXP’s SafeAssure functional safety (ASIL-B, SIL2) platform development and features six Arm Cortex-A55 cores, an Arm Mali GPU, a 4K VPU, an ISP, an ML acceleration NPU, and the Edgelock® secure enclave for security-related functions. The i.MX95 series uses the Energy Flex architecture, delivering scalable real-time capabilities, secure and application processing partitions, and high-speed connectivity (10GbE, USB 3, PCIe Gen 3), making it suitable for a variety of platforms. The SoM increases exposure of the processor’s functional pins, enabling evaluation and secondary development. It has undergone thorough environmental, stability, and aging tests to ensure reliable, stable operation.

NXP i.MX9596 SoM Key Features:

  • High-performance heterogeneous multi-core: 6× Cortex-A55 + M7 + M33
  • Edge AI acceleration: Integrated 2 TOPS NPU
  • Applications: Edge computing, automotive connectivity, smart cockpit systems, Industry 4.0 solutions, and IoT platforms

NXP New Flagship Chip

NXP i.MX95xx combines high-performance application cores, an independent MCU real-time domain, Energy Flex architecture, advanced security supported by the EdgeLock® secure zone, and dedicated multi-sensor data-processing engines (graphics, image, display, audio, and voice) to accelerate edge machine learning applications.

Safety Features

i.MX 95 series has safety features that comply with the ISO 26262 ASIL-B and IEC 61508 SIL-2 functional safety standards to support basic safety measures in automobiles and functional safety in industrial control systems.

Multicore Heterogeneous Architecture

i.MX95xx series features ARM Cortex-A55 high-performance cores along with a Cortex-M7 real-time core, delivering both high computing performance and precise real-time control.

High-performance GPU

The advanced ARM Mali-G310 GPU supports OpenGL® ES 3.2, Vulkan® 1.2, and OpenCL 3.0, delivering stunning graphics and exceptional computing performance. With the ability to manage two independent output streams, it offers versatile functions such as image rotation, resizing, color space conversion, blending, raster operations (ROP), scaling, distortion correction, and linear illumination.

High Computing Power to Empower Edge Applications

The i.MX95xx chip integrates a built-in Neural Processing Unit (NPU) with up to 2 TOPS of computing power, enabling excellent machine learning and deep learning capabilities and providing robust support for edge computing applications.

Rich CPU Interfaces

High Definition Decoding and Display Enhancement

The i.MX95xx chip supports H.264 encoding & decoding and H.265 decoding with resolutions up to 4K, easily meeting the demands of playing high-definition videos. At the same time, the chip also utilizes advanced display enhancement technology, which can further improve the picture’s contrast and color saturation, giving users a more stunning visual experience.

ISP Significantly Enhances Image Quality

The ISP technology is integrated into the i.MX95xx chip supports various image sensors and is optimized for different application scenarios. Whether it’s for industrial inspection, robot vision, or autonomous driving applications, the i.MX95xx can provide clear and accurate image data.

Broad Industry Applications

In multiple industries, including industrial, medical, power, automotive transportation, environmental monitoring, smart cabins, and IoT, the FET-MX95xx-C SoM, with its high performance, multifunctionality, and industrial-grade advantages, coupled with Forlinx’s competitive pricing and comprehensive after-sales technical support, will help your products quickly enter the market and stay ahead in the industry.

Hardware Features

FET-MX9596-C System on Module Basic Features
CPU NXP i.MX9596

Clock: 6x Cortex-A55 @ 1.8 GHz + 1x Cortex-M7 @ 800 MHz + 1x Cortex-M33 @ 333 MHz

NPU: 2 TOPS

GPU: Mali-G310 (OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0)

VPU:

  • Hardware Decoding: H.264, H.265, up to 4K @ 30 fps
  • Hardware Encoding: H.264, H.265, up to 4K @ 30 fps
RAM 8GB LPDDR4X
ROM 64GB eMMC
Input Voltage DC 12V
Operating Temperature -40°C ~ +85°C
Connector Board-to-board connector (4x 80-pin, 0.5mm pitch, Stack Height: 2.0mm)
OS Support Linux
Dimensions 50mm x 68mm

Notice: The currently released FET-MX9596-C System on Module uses an Alpha version chip, and some features are not yet supported. Please refer to the Bug List for details. The mass production chip version is expected to be available in Q1 2026, at which time the BSP version will also be updated from Linux 6.6 to Linux 6.12.

FET-MX9596-C System on Module Functional Parameters
Peripheral QTY Specification
JTAG 1 4-pin JTAG for debugging
UART Up to 8 Up to 5 Mbps
SPI Up to 8 Master/Slave mode configurable
XSPI Up to 1 Supports 2x Serial NOR/NAND Flash
CAN-FD Up to 5 Compliant with ISO 11898-1 and CAN 2.0B
SAI Up to 5 Synchronous Audio Interface
SD Card 1 Compliant with SD 3.0
SDIO 1 Compliant with SDIO 3.0
ADC Up to 8 1x 12-bit, 8-channel, 1 MS/s ADC
1 Gbps Ethernet Up to 2 1.8V RMII/RGMII, supports TSN
10 Gbps Ethernet 1 XFI, SGMII (2.5 Gbps / 1 Gbps), 10G-USXGMII, supports TSN
USB 3.0 1 Configurable as Host or Device
USB 2.0 1 Configurable as Host or Device
PCIe 2 PCIe Gen 3.0
MIPI DSI 1 1x 4-lane MIPI DSI, up to 2.5 Gbps/lane; supports 4K @ 30 Hz or 3840×1440 @ 60 Hz
MIPI CSI-2 Up to 2 Compatible with MIPI CSI-2 v1.2 and MIPI D-PHY v1.2
LVDS 1 Up to 1080p @ 60 Hz (2x 4-lane or 1x 8-lane)
I2C Up to 7 Standard I2C interface
PDM 1 Supports up to 8-channel microphone input
SPDIF 1 Sony/Philips Digital Interface
PWM Up to 6 Pulse Width Modulation outputs
GPIO Up to 111 General Purpose I/O

Additional information

Dimensions 2.67717 × 1.9685 in

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