Properties and Applications of Polyimides
Polyimide (PI) is a polymer with an imide ring structure in the backbone. PI has been widely used in the aerospace and microelectronics industries as an essential, high-performance polymer due to its excellent thermal stability, mechanical properties, dimensional stability, chemical resistance, and insulation properties. Some typical applications of PI include high-temperature resistant coatings for spacecraft, structural support materials for light spacecraft, solar cell substrates, flexible printed circuit boards, and insulation layers for large integrated circuits.
PI aerogel materials’ research and application progress in thermal insulation, low dielectric, hydrophobic, environmental remediation, and other aspects were reviewed. Chapter 2 summarizes the latest progress in the field of PI-based thermal conductive materials, summarizes the general rules of the formation of thermal channels in composites, and introduces the latest progress of PI-based thermal conductive films obtained after graphitization, hoping to provide some guidance for the future research of thermal conductive PI materials. In the third chapter, the application of PI adhesive in the bonding of metal, battery, and hybrid materials is introduced, and the influence of molecular structure on the bonding performance is analyzed. This chapter evaluates the effect of structure on properties and explains the macroscopic properties of these adhesives according to their microstructure.
Table of Contents
Preface
Chapter 1. The Functionalization and Applications of Polyimide Aerogels
Zhen Fan, Changwei Liu, PhD and Dezhi Wang, PhD
Institute of Petro Chemistry, Heilongjiang Academy of Science, Harbin, China
Chapter 2. Thermal Conductivity Enhancement of Polyimide and Polyimide Composites
Junyu Zhao¹, PhD, Hongwei Zhou¹, PhD, Xiaogang Zhao¹, PhD and Chunhai Chen², PhD
¹Key Laboratory of High-Performance Plastics, Ministry of Education, National and Local Joint Engineering Laboratory for Synthetic Technology of High-Performance Polymer, College of Chemistry, Jilin University, Changchun, China
²Center for Advanced Low-Dimension Materials, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, China
Chapter 3. Temperature-Resistant Polyimide Adhesives
Daoxiang Zhao¹,², PhD and Ning Ma¹,², PhD
¹College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin, China
²Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
Index
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